Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies

In this paper, principal component regression models (PCR) have been investigated for reliability prediction and part selection of area package architectures under thermo-mechanical loads in conjunction with stepwise regression methods. Package architectures studied include, BGA packages mounted on CU-CORE and NO-CORE printed circuit assemblies in harsh environments. The models have been developed based on thermo-mechanical reliability data acquired on copper-core and no-core assemblies in four different thermal cycling conditions. Solder alloys examined include SnPb and SAC Alloys.