A High Throughput X-Ray Lithography with a Negative Resist for 0.3μm Devices

X-ray lithography , after years of technology development, is now emerging as a leading contender for submicoron VLSI printing. One of the most severe obstacles in the application of x-ray lithography to volume production is the lower throughput than conventional optical lithography. An effective approach to maximize the throughput is to develop high sensitive x-ray resists. However, any practical x-ray resists which have high resolution capability and high dry etch resistance as well as high sensitivity have not yet been reported.