Laser as a Future Direction for Wafer Dicing : Parametric Study and Quality Assessment

In the recent years, laser dicing had emerged as an feasible alternative to blade dicing, with its parametric effect yet to be understood completely. This paper focuses on the parametric study of the laser dicing and had established a parameter prediction graph on the cutting depth to Kerf width ratio with respective to the specific laser influence. By comparison to conventional diamond blade dicing, the quality and processability of the laser diced wafers are assessed, indicating its advantages and limitations. The result shows that laser is capable of reaching 2.5 times faster feed speed with comparable sawing quality to blade dicing, for thin wafers (<70μm) application and less competitive in thick wafers(>175μm).