Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding

A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.