Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)

PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.