Wafer Level Integrated Antenna Front End Module For Low Cost Phased Array Implementation

This paper describes the implementation of a fully integrated antenna front-end that leverages Northrop Grumman Space Technology's (NGST's) novel wafer level packaging technique to marry the optimal technology per function through the bonding of III-V wafers. To demonstrate the proposed approach, a 4-element Q-band linear array has been assembled and tested to validate the concept.