Novel Flip-Chip Bonding Technology using Chemical Process

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.