Manufacturing and Characterization of Nano Silver Particles Based Thermal Interface Material

Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it can result in failure of microelectronics components. A critical issue is the removal of this heat generated. We report here a new type of nano thermal interface material (Nano-TIM) using the electrospinning process with nano silver particle as thermal enhancement filler. With the electrospinning process, polymer nanofibers are formed in nano scale in diameters. The morphology of the nanofibers is of optimum importance and scanning electron microscopy (SEM) was used to analyze it. The characterization of the nanofibers was carried out using thermo-gravimetric analyzers (TGA) and differential scanning calorimeter (DSC) to determining the degradation and melting temperature of the nanofibers. The mechanical property was analyzed using an Instron micro-functional mechanical tester. The work shows that nano-TIM with nano silver particles has significant potentials to replace conventional thermal pad materials.