Ceramic Interposer for Optoelectronic Array Devices

The paper presents the design, fabrication process and characterization of novel ceramic carrier package for parallel optical transmitter/receiver multi-chip module (MCM) are presented. The module integrates function of electrical-to-optical signal conversion (and back again) and the optical in and out-coupling into the PCB-integrated waveguides. Assumed solder-bumped flip chip bonding technology for assembly of optoelectronic array devices (vertical cavity surface-emitting lasers - VCSELs - and p-i-n-photodiodes) takes advantage of the self alignment feature. Furthermore the package is a ball-grid array (BGA) package, which is characterized by its cost effectiveness and compatibility with the standard SMT process. The integrated micro-optical component contains a 45deg mirror surface for light deflection, enabling indirect light coupling from the OE devices into the waveguides. This optical system will be characterized in the regard of coupling efficiency to define the tolerances for alignment of OE devices.