A Reliable Dry Ceramic Dual In-Line Package (CERDIP)

The ceramic DIP package utilizing low temperature (~500°C) sealing glasses has been simultaneously widely deployed for packaging IC's and condemned for many high reliability applications because of high, moisture content in the sealed cavity. This paper describes the construction, characteristics, and reliability performance of a volume producible, cost-effective Cerdip which has a sealed moisture content typically less than 500ppmv.