Fluorinated Aromatic Polyimides for Advanced Microelectronics Packaging Applications

A series of novel fluorinated polyimides have been synthesized by the polycondensation of 4,4'-oxydiphthalic dianhydride (ODPA) with 1,4-bis(4-amino-2-trifluoromethyl-phenoxy) benzene (6FAPB) and 4,4'-bis(4-amino-2-trifluoro-methylphenoxy) biphenyl (6FBPB) in the presence of phthalic anhydride (PA), or phenylethynyl phthalic anhydride (PEPA) as molecular weight-controlling and end-capping agents. The molecular weight-controlled fluorinated aromatic polyimides showed great solubility in organic solvents and good melt ability at elevated temperatures. Thus, glass fiber-reinforced polyimide laminates have been fabricated by thermally curing the B-staged glass/polyimide prepregs which was prepared by impregnating polyimide solution on glass fiber cloths followed by thermal baking. Experimental results demonstrated that the glass/PI laminates exhibited great thermal stability and good mechanical properties