Modeling & Measurements of EM Effects in Multichip Modules

Rome Laboratory is determining the reliability and electromagnetic (EM) performance of multichip modules (MCM) using an integrated multi-disciplinary analysis and measurement methodology. Simulations and Measurements of EM Effects are used to evaluate the susceptibility of MCM technologies and to determine their vulnerability in their operational environments. EM effects are simulated using modern computational electromagnetic (CEM) analysis techniques to determine the fields within the package. Thermal effects in the MCM are simulated using the Intelligent MCM Analyzer which uses finite-element analysis within a object-oriented data base architecture to determine thermal heating effects. This paper will discuss the results of EM Effects measurements and simulations performed on MCM's to determine their conducted EM performance characteristics. This paper will also assess the feasibility of performing EM effects evaluations with less complex devices and models prior to full scale development. The MCM's evaluated include a MMIC Transmit/Receive (T/R) Module and a High Speed Random Assess Memory (RAM).