Study on the lapping slurry for ULSI silicon substrate preparation

Lapping is one of the basic procedures in silicon device substrate preparation. There exist excess stress, serious surface scratch, damage and pollution of ion in the procedure of lapping process, so it is necessary to improve the mechanism of lapping through changing the single mechanical action to equilibrium chemical and mechanical action. Under the condition of chemical mechanical action, small damage and low stress on silicon wafers can be gained, which can decrease the breakage and stress accumulation. Then the product quality and machining efficiency can be improved. In this study, the lapping slurry mechanism of action was introduced, and the operation significance and development status were analyzed. Through improving the original lapping slurry, the dispersibility and floatability of lapping slurry was improved. The component, action and mechanism of lapping slurry were also introduced