A robotics package assembly system

A robotics packaging assembly system for use in demonstrating the manufacturability of new RF module designs in a package development environment is described. The programmable line accommodates a variety of flip chip technologies, substrate materials and process conditions by means of stored program retrieval and execution. System requirements are discussed along with principles used in package design for assembly in a machine vision environment. Flip chip technology is one of the central design elements used to obtain automated assembly of low cost, small outline packages with stable RF performance. System performance is given for the assembly of flip chip Si and GaAs devices.<
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