A New 1200V Converter-Inverter-Brake (CIB) Module Family Featuring CSTBT Chips and a New 1200V High Voltage Integrated Circuit (HVIC)

Intelligent Power Modules (IPMs) in the 600V class have been successfully applied to a variety of industrial and consumer applications for upwards of ten years. Transfer Mold manufacturing technology was adopted about eight years ago to reduce cost and simplify and miniaturize inverters. Continued improvements in the internal module construction with lead frame and heat spreader optimization along with significant improvements in IGBT chip technology with the adoption of the Carrier Stored Trench BiPolar Transistor (CSTBT™) approach have resulted in a cost effective, reliable, and thermally efficient power module technology. Today's 600V DIP IPMs are capable of driving up to 3.7kW. This paper presents the advancement of the transfer mold packaging technology to a 1200V Converter-Inverter-Brake (CIB) module rated from 10 to 25A at 1200V which is driven and protected by a new 1200V HVIC. The features of the new DIP CIB and the functionality of the 1200V HVIC are explained. The complete power stage for up to 3.7kW inverters including three-phase input rectifier, brake chopper, and three-phase inverter as well as an NTC thermistor for temperature sensing of the base plate has been "transfer molded' into one compact package with particular attention to the minimum strike and creep distances required by UL and IEC.