High bit rate optical transmitter module realised in opto-hybrid technology

New packaging technologies for optical components are required for the increasing demands of the telecommunications industry. The use of a silicon motherboard as an optical bench has been recognised for some time as an excellent method of combining good stability with low cost through simpler packaging techniques. We report here in detail on a single mode transmitter module based on this technology operating at 2.4 Gbit/s. An eight element array transmitter has also been realised and is discussed briefly.<
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