High density surface mounting power supply

The various stages in the design of a high-density surface-mounted power supply are described, including the development of the passive power components, power chip carrier package, and interconnection substrate. Emphasis is on the design and minimization of the power ceramic capacitor, quadrupole capacitor, and transformer components. The construction of a 16-60 V/5 V 20 A DC-DC converter using this technology has demonstrated that performance improvement and additional miniaturization requires the optimization of the pulse-width modulator of the power converter.<
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