High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES)

MCM/sup L/ can expect to be the main current of semiconductor packaging technology in near future. BGA, PLCC and PGA packaging methods will expect much of this application. But the most pressing problem is warp after the packaging process. The warp after packaging needs to be below 150 /spl mu/m at BGA and 100 /spl mu/m at PLCC. We have already developed the Printing Encapsulation Systems (PES). PES is able to make low cost and mass produced semiconductor packaging. This paper describes the use of PES to make MCM/sup L/ semiconductor packaging. We have developed a low warp packaging epoxy resin using elastomer modified epoxy resin to fit BGA, PLCC and PGA. We verified the low stress epoxy resin using dynamic mechanical properties and internal stress measurements. We packaged BGA, PLCC and BGA with this low stress epoxy resin using PES, and measured the warp of each packaging. We obtained good results for the warp, demonstrating that using this low stress epoxy resin and PES, low cost and high reliability packaging of BGA, PLCC and PGA could be achieved.<
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