Kerf reduction using shaped wire

The photovoltaic industry is expected to grow at an increased rate and most modules use crystalline silicon wafers. Since silicon material and slicing costs are at least one-third of the module cost, it is imperative that a minimum amount of material is used and that slicing is efficient. A novel approach has been developed for fixed abrasive slicing technique (FAST) slicing to reduce kerf width and improve slicing using shaped wire. The feasibility of producing a teardrop shaped wire has been demonstrated. A slicing test with a round wire formed into a shaped wire by electroforming has shown reduced kerf and higher cutting rates. The combination of FAST slicing with shaped wire is expected to result in effective slicing and improved material utilization.<
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