A magnetic-head with back-side connections

This paper describes the construction and the technology of an integrated sensor with a flux-sensitive magnetic head containing magneto-sensitive transistors (MST). The head is intended to read information from several tracks simultaneously, when the read signals are reproduced repeatedly (reverberation multitrack head). The technology allows one not only to manufacture buried monocrystal silicon wells for IC components on a dielectric substrate (silicon on dielectric, SOD), but also to manufacture insulated silicon columns in a substrate to connect front and back sides of the chip. This technology is called silicon through-dielectric (STD).<
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