Magnetic design of a cathodic arc and sputtering polyvalent source for vapour deposition

This paper presents a new design for the magnetic field configurations in a polyvalent source which will allow cathodic arc and sputtering deposition processes from a rectangular target. The strength and direction, of magnetic fields are modelled by a software package, based on finite element analysis. In the sputtering magnetron mode, a high degree of parallelism of the magnetic field on the target surface is achieved, increasing the target erosion. Electromagnetic control of the cathodic arc spot will be done by coils alternately powered that create closed paths avoiding the spot fixation. Finally, the presented design is compared with a commercially available magnetron source.<>