End users access to prototype and production MCMs

The authors point out that the GE high density interconnect multichip module (HDI MCM) process has been broadly applied to many types of advanced system architectures, and recently the CAD technology has been transferred into the hands of a community of system designers. This HDI CAD process is based on a commercial, non-proprietary tool suite that has been successfully utilized at more than 10 remote sites. The dissemination of the GE HDI design methodology to various sites is detailed, and the CAD tools and techniques involved with the HDI interface to both the GE prototype and TI Merchant MCM Foundry are compared. Several HDI project case studies involving CAD tool usage and module production, from chip procurement and design transition to finished, tested modules, are described.<
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