Failure mechanisms of thin silicon tantalum integrated circuit (STIC) resistors on multi-chip module (MCM)

Failure mechanisms of STIC (silicon tantalum integrated circuit) resistors on low voltage CBIC (complementary bipolar integrated circuit) devices, assembled onto MCMs (multichip modules), are investigated with specially designed testers. In general, STIC resistors are stable and fit for microelectronic circuit applications. It is shown that thermally stabilized STIC resistors could be destabilized with a basic solution of pH>10 and could subsequently be degraded under the influence of an electric field. The anodization process is shown to follow a phenomenological equation. A model for the possible failure mechanism which includes MCM assembly defluxing solutions, moisture, alkaline elements, and applied voltage is proposed.<>