Interconnections/micro-networks for integrated microelectronics

An overview of interconnections within microelectronic systems is provided from the viewpoint of a communications-oriented audience, drawing on the expected evolution to ULSI systems. General issues and opportunities arising in the area of interconnections and packaging are discussed, along with some important characteristics suggesting the need for new communication network architectures and protocols for micronetworks. Several of the technology issues are reviewed, with particular emphasis on advanced packaging evolving for present VLSI systems. Performance models for the communications channels provided by microelectronic interconnections are summarized. High-speed communications within a microelectronic system are considered.<
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