Optimization and design of plasma etching process utilizing a glow discharge model and a transport model simulation

A glow discharge model and a neutral transport model were developed to optimize and to design the plasma reactors. Simulation was performed for a parallel-plate single-wafer plasma etching reactor. Using the glow discharge model, the distinct features of electronegative discharge compared to electropositive discharge were revealed. In addition, the effect of pressure, interelectrode spacing, RF/DC voltages, and applied frequency on discharge physics was investigated. The neutral transport model was utilized to study etching rate and uniformity as a function of reactor geometry and operating conditions. Model predictions showed good agreement with experimental results obtained using optical emission spectroscopy. Two novel reactor designs were proposed to improve the reactor performance. These include a graded gas velocity at the reactor inlet and a plasma-impulse mode of operation.<
>