Silicon microsensors and microstructures

Microsensors and micromechanical structures realized by industrial CMOS technology with compatible postprocessing deposition or micromachining are presented. Fabrication methods are described for thermomechanical and other microsensors realized by combining silicon micromachining with industrial CMOS or bipolar IC technologies. The procedure allows inexpensive batch fabrication of thermal and mechanical microsensors with on-chip driving and signal conditioning circuitry. Examples include a capacitive moisture sensor, thermoelectric power and infrared sensors, and an acoustic transducer.<
>