Physical assembly for analog compilation of high voltage ICs

A description is given of the aspects of mixed analog and digital physical assembly relevant to analog silicon compilation. The approach addresses system-level analog design automation through silicon compilation; currently this consists of the synthesis of analog and predesigned digital blocks. The compilation is based on successive decompositions of high-level specifications and physical assembly requirements into those of lower level subblocks and devices. The driving applications are high-voltage application-specific integrated circuits (ASICs). Details of analog and system level physical assembly to satisfy a set of mixed analog, digital, and high-voltage requirements are presented together with the results from an implementation of the compiler.<
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