A new moisture resistant liquid encapsulant

A novel silicon-carbon thermosetting resin has been developed for semiconductor encapsulant applications. The resin and liquid encapsulant formulations have exceptional moisture resistance, good ionic purity, excellent electrical properties, long pot life, and good thermal and mechanical properties. The new liquid encapsulant can provide improved reliability, and should be considered for use in glob top and potting applications. Possible areas of use include encapsulation for chip on board (COB), tape automated bonding (TAB), chip carriers, and multichip modules.<
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