A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components

A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described.<
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