IC performance prediction from electrical test measurements

A model for integrated circuit (IC) binning has been built using measurements collected on a high-volume manufacturing line. This model uses electrical measurements collected before packaging in order to predict the high-speed performance of manufactured parts before final test. A small set of measurable parameters responsible for the variation in fabricated parts was identified. The statistically significant, linear performance prediction model was built using data from a 1-Mbit CMOS EPROM production line. The applications of the model include aiding the packaging decision, production planning and scheduling, process characterization, and control and design for manufacturability.<
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