High density multichip systems

Summary form only given. It is noted that system designers are seeking tools that can effectively aid them all through the design process, concurrently, at the chip, module, and system levels beginning from the initial specification phase right to bending metal. These tools must be able to manage designs containing over 10 million logic gates and be able to explore alternate technologies, with knowledge of test strategies and manufacturing practices, permitting the designer/manager to choose the combinations best suited for their application. The challenge is to put necessary CAD/CAE (computer-aided design and engineering) tools together so that the engineer can be effectively supported through the designs of complex multichip systems such that decisions can be made intelligently and quickly as early in the design cycle as possible before any actual metal bending begins. A representation of a concurrent design approach for multichip systems is presented. It is a datacentric model, in which the design begins at the center with very little data or information about the system.<
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