Convection and radiation heat transfer analysis in three-dimensional arrays of electronic components

The combined effect of convection and radiation heat transfer is studied in an array of electronic chips mounted between two parallel plates. The chips are cooled by a radiatively nonparticipating gas flowing inside the passage. The three-dimensional convection part of the problem was solved using the 19-point finite analytic method and radiation analysis using the discrete ordinates method. Results showing the effects of convection alone and combined radiation and convection are presented. For the geometry and conditions studied, radiation heat transfer represents 33% of the total heat transfer.<>