Increasing Efficiency of a Chemical-Mechanical Polishing of the Silicon Wafer

The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process