Design for A/D converter reliability for low temperature applications

In this paper, we present a design for reliability approach on analog to digital (A/D) converters for low temperature applications. Parametric degradation, including drain saturation and linear currents, threshold voltage, transconductance and drain conductance, have been characterized to translate the hot carrier aging impact on A/D circuits under low temperatures. Both substrate current profile and operating temperature profile have been taken into consideration to determine the most applicable transistor size to be used in the A/D converter and to ensure the required A/D converter reliability for low temperature applications.