Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications

High-K inorganic materials generally show high loss or high TCC or both, making them unsuitable for RF capacitor applications where high Q, tolerance and thermal stability are critical. Most polymers do not have the required total set of attributes, making it extremely challenging to integrate high-performance RF thin film capacitors in organic packages and boards. In this paper, we demonstrate a strategy to tailor the properties of polymeric composite materials and satisfy all the RF capacitor requirements. With this strategy, it is feasible to meet low TCC and low loss while increasing the capacitance density or permittivity to miniaturize RF components.