The scalable modeling of multi-layer embedded capacitor based on LTCC substrate

Low temperature co-fired ceramic (LTCC) technology is the preferred platform for integrating multi-layer capacitors due to excellent high frequency performance and low-loss dielectric properties. This letter describes an approach to perform modeling of multi-layer capacitors in LTCC technology. This hybrid approach combines both analytical modeling and numerical modeling to provide a scalable circuit model predicting the self-resonance frequency of the multiple dielectric and electrode layers. Good correlation between the simulation results and network analyzer measurements has been also achieved.