AC coupled interconnect using buried bumps for laminated organic packages

Various techniques for providing non-contacting, interchip signaling have been demonstrated, such as: ACCI presented in S. Mick et al. (2002) and L. Luo et al. (2005), proximity communication based in R. Drost et al. (2004), and wireless superconnect (WSC) reported in K. Kanda et al. (2004). ACCI using buried bumps is the only technology that provides a manufacturable solution for non-contacting I/O signaling by integrating high-density, low inductance power and ground distribution with high-density, high-speed I/O. This completely integrated solution has been demonstrated at 2.5Gb/s/channel across 5.6cm of micro-strip transmission line using 0.35/spl mu/m CMOS ICs that were flip-chip attached onto a silicon MCM-D as presented in J. Wilson et al. (2005).