1Gb/s Ethernet physical layer device package development

The 82566 family of LAN products are Intel LAN Access Division's (LAD) generation 90nm silicon gigabit LAN connection devices with an integrated PHY, designed in a 2 layer flip chip molded matrix array package (FCMMAP). The use of 2 layer FCMMAP technologies leveraged a number of cost reduction, thermal performance and design improvements offered over an alternative 4 layer stacks up. This paper describes the various design and electrical performance optimizations that were implemented to achieve an improved package design to meet the requirements for the high speed proprietary SerDeS and gigabit PHY interfaces