Optimization of Ultrasonic Cleaning for Erosion-Sensitive Microelectronic Components

In this paper, we describe an experimental study undertaken to investigate ultrasonic fields in the frequency range 58-192 kHz with respect to their surface cleaning and erosion potential. Measurements are performed using three different methods - gravimetric weight-loss, surface profilometry, and precision turbidimetry - to assess these mechanisms for a variety of materials, including semiconductors. Conclusions are drawn regarding the nature of interaction between high-frequency, high-intensity ultrasonic fields and immersed surfaces. Recommendations are provided for optimal settings to maximize surface cleanability and minimize erodibility of sensitive substrates