A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15/spl times/15/spl times/1.905 mm/sup 3/ achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz.