MEMS test structure for measuring thermal conductivity of thin films

A novel MEMS test structure and measurement procedure is presented with which the lateral thermal conductivity of thin films can be easily and accurately extracted. The extraction procedure is discussed in detail and supported by numerical simulations. Experimental examples are given for the determination of the lateral thermal conductivity of aluminium (Al), aluminium nitride (AlN), and p-doped polysilicon (polySi) thin films.