Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography

By using both FEMLAB simulator and the Thermography, the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. And, the deformation pattern was measured by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3-D graphic image