A robust MEMS probe card for fine pitch test using a new cantilever moving scheme

A vertically guided MEMS probe card, designed to achieve a deflection of 50 /spl mu/m at a force of 1.5 gram (g) and less than 50 /spl mu/m of pad pitch, was developed. Based on our experimental results, the measured average contact resistance was approximately 0.2 ohm (Q at 1.44 g of force with leakage current approximately 10 pA between the tips and pads. In addition, tip planarity was about /spl plusmn/6 /spl mu/m with x-y alignment errors within /spl plusmn/8 /spl mu/m. A reliability test was performed, the average contact resistance was 0.4 /spl Omega/ and the probe tip wear was less than 1 /spl mu/m after the 10,000 time touchdowns. This newly proposed probe card is suitable for wafer-level testing and fine pitch device testing.