Package-level integration of LTCC antenna

In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 /spl times/ 10.3 /spl times/ 1.3 mm/sup 3/ and this package contains 8.3 /spl times/ 8.3 /spl times/ 0.7 mm/sup 3/ space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur in a slightly higher frequency region due to manufacturing tolerances.