Broad bandwidth TeO2acoustooptic devices bonded with tin metal

A paratellurite acoustooptic device with broad bandwidth characteristic has been developed by using a tin adhesion layer instead of indium for a X-cut LiNb03 transducer bonding. Acoustic impedances of tin and indium evaporated layers for shear sound wave were estimated to be about 9.1 X l0
⁵
and 5.5 X l0
⁵
g/cm
²
s from coincidences between experimental results and simulations, respectively. A typical device with a near quarter wavelength thickness of a tin layer yielded about 100% 3 dB bandwidth at the midband frequency with the minimum insertion loss of 0.1 dB.