Influence of flux activity on process parameters and solder joints in lead-free wave soldering

Electronics manufacturing has responded well to environmental concerns such as role of CFCs (and related compounds) in stratospheric ozone depletion (Cala and Winston, 1996), and the toxicity of lead. To those who understand these demands the producers of fluxes recommend VOC-free fluxes especially for lead free wave soldering. This paper reports investigation of the influence of the VOC-free flux properties on lead-free wave soldering process. Three commercial no-clean liquid fluxes which based on water were used for PCBs soldering with SnAg and SnAgCu alloys on the wave machines. The influence of fluxes properties and nitrogen atmosphere on wave process parameters and solder joints quality were established. The conclusions important for lead-free wave soldering practice are presented