Self-assembling electrical networks: an application of micromachining technology

It is noted that the recent applications of silicon processing technology to the manufacture of micro-mechanical devices may allow engineering of self-assembling systems. Preliminary experiments show that regular two-dimensional lattices of at least 1000 millimeter-sized elements can be mechanically self-assembled using a method analogous to crystal annealing. Physical considerations suggest that conditions become more favorable to the process as size decreases, and give rise to guidelines for optimal design. Applications to IC manufacturing are discussed. The method requires large numbers of identical, freely moving discrete elements fabricated with a controlled three-dimensional geometry, and thus may be an area in which micromachining technology can be used to advantage.<
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