Packaging of filter-integrated hybrid transceiver for subscriber access network

We demonstrated a low-cost packaging of bidirectional transceiver using filter-integrated PLC platform for subscriber access networks. An adiabatic WDM filter was optimized and designed by BPM simulation. We fabricated a bidirectional transceiver using modified multi-chip bonding scheme for flip-chip bonding of active components and V-shaped groove for optical interconnection. As a result, the optical performance of fabricated transceiver satisfied the criteria required by Ethernet passive optical network.