De-embedding effects on HBT device performance

This paper presents a de-embedding approach for modeling of high frequency devices on finite thickness substrates with no via holes. Mounting of finite thickness wafers on high-performance substrates eliminated the problem of resonance observed during TRL calibration. This calibration approach de-embeds the pad launcher parasitics for devices on finite thickness wafers without vias correctly up to hundreds of GHz. Experiments demonstrate that, accurate high-frequency de-embedding helps to improve the f/sub T/ and f/sub max/ values of HBT devices.