Multi-user hybrid process platform for MEMS devices using silicon-on-insulator wafers

A new multi-user hybrid surface and bulk micromachining process on silicon-on-insulator (SOI) wafers is discussed. This 13-mask process consists of a doped polysilicon layer for electrical connection and non-critical structures and a single crystal silicon (SCS) layer for excellent optical and mechanical properties in the critical MEMS design. There are 7 masks for doping and etching of the SCS layer. The flexibility and versatility of this process allows for microsystems designs such as actuators, optical gratings, and dimples/anchors on the SCS layer. The MEMS devices fabricated and tested in this paper include thermal actuators, hinges, latches, optical switches, mirrors, and waveguides.